摘要 |
<p>A development liquid nozzle is moved from an outer edge of a wafer toward the central portion while an exposed substrate held at a spin chuck is being rotated about a vertical axis and while a development liquid is being discharged from the development liquid nozzle, and this way the development liquid is supplied to the surface of the wafer, the development nozzle having a slit-like discharge opening whose longitudinal direction is oriented to the direction perpendicular to the radial direction of the wafer. The movement speed of the nozzle is higher than a case where a nozzle with a small-diameter circular nozzle is used, and this enables a development time to be reduced. Further, the thickness of a development liquid on a substrate can be reduced, so that the development liquid can be saved.</p> |
申请人 |
TOKYO ELECTRON LIMITED;OOKOUCHI, ATSUSHI;YAMAMOTO, TARO;TAKEGUCHI, HIROFUMI;KYOUDA, HIDEHARU;YOSHIHARA, KOUSUKE |
发明人 |
OOKOUCHI, ATSUSHI;YAMAMOTO, TARO;TAKEGUCHI, HIROFUMI;KYOUDA, HIDEHARU;YOSHIHARA, KOUSUKE |