发明名称 |
FILM-FORMING APPARATUS AND FILM-FORMING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film-forming apparatus which reduces a film-forming cost by improving an utilization efficiency of a precursor used for film formation, and to provide a film-forming method therefor. <P>SOLUTION: The film-forming apparatus is directed at forming the film by supplying a treatment medium containing a medium in a supercritical state and the precursor to a substrate to be treated, and comprises: a treatment vessel; a pedestal that holds the substrate to be treated which is placed in the treatment vessel, and has a heating means; a medium-supplying portion which is connected to the treatment vessel through a medium-supplying path and supplies the treatment medium to the treatment vessel; and a medium-refluxing path for refluxing the treatment medium supplied to the treatment vessel to the medium-supplying portion, wherein the medium-supplying portion has a temperature-controlling means for controlling a temperature of the treatment medium. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2005187879(A) |
申请公布日期 |
2005.07.14 |
申请号 |
JP20030430575 |
申请日期 |
2003.12.25 |
申请人 |
TOKYO ELECTRON LTD;KONDO HIDEKAZU |
发明人 |
BUZAN BANSON;KUBO KENICHI;KOMIYA TAKAYUKI;KONDO HIDEKAZU |
分类号 |
C23C16/455;B05C11/00;C23C4/12;C23C16/00;C23C26/00;C23C26/02;H01L21/285;H01L21/288;H01L21/768;(IPC1-7):C23C16/455 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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