| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a CSP type semiconductor device in which an yield is enhanced by utilizing a general purpose gang bonding system bonder, and to provide a film carrier tape for use in the method. SOLUTION: The manufacturing method of the semiconductor device comprises a step for forming a wiring pattern 16 having a bonding part 16a to the electrode 13 of a semiconductor chip 12 on a film carrier tape 30, a step for forming a false film carrier tape 20 having a false pattern 26 of the same shape as the wiring pattern 16 having a false bonding part 26a identical to the bonding part 16a and a hole 22 formed in a region corresponding the false bonding part 26a, a step for arranging the false film carrier tape 20 and the semiconductor chip 12 such that the false bonding part 26a and the electrode 13 face each other, a step for positioning the false bonding part 26a and the electrode 13 while observing from the hole 22, a step for removing the false film carrier tape 20 and arranging the film carrier tape 30 at the same position, and a step for bonding the bonding part 16a and the electrode 13. COPYRIGHT: (C)2005,JPO&NCIPI
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