发明名称 PRINTED WIRING BOARD OF HIGH HEAT CONDUCTIVITY
摘要 PROBLEM TO BE SOLVED: To provide a novel high heat conductivity printed wiring board which is excellent in thermal conductivity and capable of promptly radiating heat on a circuit, which is capable of effectively reducing noise generated on the printed wiring board by constructing a filter using a substrate, and which is capable of making the filter fully operated since radiation property of the substrate is excellent. SOLUTION: The invention is a novel high heat conductivity printed wiring board 1 in which a plurality of conductive layers 12A and 12B are laminated on a carbonaceous substrate 10 via insulating layers 11A and 11B, respectively. A through-hole 13 is formed in the high heat conductivity printed wiring board 1. A coil member 14 is embedded in the through-hole 13 and the plurality of conductive layers 12A and 12B are connected to each other. The coil member 14 and the inner periphery surface 131 of the through-hole are insulated from each other. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005191509(A) 申请公布日期 2005.07.14
申请号 JP20040033249 申请日期 2004.02.10
申请人 SUZUKI SOGYO CO LTD 发明人 NAKANISHI MOTOYASU
分类号 H05K1/09;H05K1/03;H05K1/11;(IPC1-7):H05K1/11 主分类号 H05K1/09
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