| 摘要 |
PROBLEM TO BE SOLVED: To obtain a circuit board which is satisfactory in connection reliability between a via conductor and a wiring conductor, and in which surface planarity and packaging nature of an electronic component are proper. SOLUTION: Conductive paste for forming via conductor contains metal powder, solvent and organic binder. Addition of resin powder, which has difficult solubility to the solvent, is performed in a range from 0.1 weight part to 5.0 weight part with respect to the metal powder 100 weight part. COPYRIGHT: (C)2005,JPO&NCIPI
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