发明名称 LOW THERMAL CONDUCTIVE FRAME MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a frame material capable of being surely fixed with a wall material or the like and obtaining it having low thermal conductivity and suppressing the lowering of strength at a low cost. SOLUTION: The low thermal conductive frame material is so constituted that the frame material has a flange section and a web section, discontinuous dividing groove holes are alternately provided to the web section in the longitudinal direction and, at the same time, that the dividing groove holes push up or down one side or both sides of a cutting groove to provide it as a void equipped with a vertical side. Accordingly, a heat flow course is intercepted or lengthened by the void to lower heat conduction and, at the same time, the lowering of rigidity of the frame material can be suppressed by the existence of the vertical side. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005188074(A) 申请公布日期 2005.07.14
申请号 JP20030428593 申请日期 2003.12.25
申请人 NISSHIN STEEL CO LTD 发明人 MITSUI YUKIE;OOTA YUUGO;TSUCHIYA NOBUYUKI
分类号 E04B1/76;E04C3/08;E04C3/32;(IPC1-7):E04C3/08 主分类号 E04B1/76
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