| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film-forming apparatus for stably and efficiently forming a thin film having a desired composition, and to provide a thin-film-forming method. SOLUTION: A sputtering target 29b used for forming the thin film on a substrate by sputtering has a backing plate 29b_p, a plurality of first target materials 29b<SB>2</SB>, 29b<SB>3</SB>and 29b<SB>4</SB>held on the backing plate 29b_p, and the second target material 29b<SB>1</SB>which is formed of a material different from that of the first target materials 29b<SB>2</SB>, 29b<SB>3</SB>and 29b<SB>4</SB>, and is held on the backing plate 29b_p. The thin-film-forming apparatus forms the thin film so as to give it a composition ratio corresponding to the number ratio of the first target materials 29b<SB>2</SB>, 29b<SB>3</SB>and 29b<SB>4</SB>to the second target material 29b<SB>1</SB>, when using the sputtering target 29b. COPYRIGHT: (C)2005,JPO&NCIPI
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