发明名称 HIGHLY DIELECTRIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a highly dielectric resin composition for obtaining a practicable antenna having high relative permittivity. SOLUTION: The highly dielectric resin composition is one prepared by adding an inorganic filler to at least one thermosetting resin selected from a diallyl phthalate resin and a phenolic resin, wherein the synthetic resin is a resin having a soldering heat resistance of 300°C or higher when used in the form of a resin composition, the inorganic filler is a surface-treated inorganic filler, the highly dielectric resin composition has relative permittivity of 10 or higher in a high-frequency band of at least 1 GHz, and the surface treating agent is a silane coupling agent. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005187551(A) 申请公布日期 2005.07.14
申请号 JP20030428547 申请日期 2003.12.25
申请人 NTN CORP;ASAHI ORGANIC CHEM IND CO LTD 发明人 OHIRA AKINARI;NAKAJIMA TATSUO;ASAI KEIJI
分类号 C08L101/00;C08K9/00;C08L31/08;C08L61/06;(IPC1-7):C08L101/00 主分类号 C08L101/00
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