发明名称 |
METHOD FOR CUTTING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method capable of reducing the breaking occurring at the machining end part while suppressing a grinding wheel abrasion amount during cutting when a substrate made of an aluminum nitride sintered body is cut with a cutting grinding wheel. SOLUTION: When the substrate made of the aluminum nitride sintered body is cut by a rotating grinding wheel, the substrate is cut by the rotating grinding wheel using diamond abrasive grains having an average grain size (X;μm) satisfying the range expressed by formula (1): 2d≤x≤150/d to the average crystal grain size (d;μm) of the aluminum nitride sintered body. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005186211(A) |
申请公布日期 |
2005.07.14 |
申请号 |
JP20030430692 |
申请日期 |
2003.12.25 |
申请人 |
TOKUYAMA CORP |
发明人 |
YAMANE KAZUHIRO;AZUMA MASANOBU |
分类号 |
B24D3/00;B24D5/12;B28D5/00;(IPC1-7):B24D3/00 |
主分类号 |
B24D3/00 |
代理机构 |
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代理人 |
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地址 |
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