发明名称 |
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof |
摘要 |
The invention relates to a recyclable donor wafer that includes a substrate and a formed layer thereon, wherein the formed layer has a thickness sufficient to provide (a) at least two useful layers for detachment therefrom and (b) additional material that can be removed to planarize exposed surfaces of the useful layers prior to detachment from the donor wafer.
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申请公布号 |
US2005150447(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
US20050075323 |
申请日期 |
2005.03.07 |
申请人 |
GHYSELEN BRUNO;AULNETTE CECILE;OSTERNAUD BENEDITE;AKATSU TAKESHI;FAURE BRUCE |
发明人 |
GHYSELEN BRUNO;AULNETTE CECILE;OSTERNAUD BENEDITE;AKATSU TAKESHI;FAURE BRUCE |
分类号 |
B44C1/22;H01L21/302;H01L21/762;(IPC1-7):C30B23/00 |
主分类号 |
B44C1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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