| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the chipping of a semiconductor chip. <P>SOLUTION: A semiconductor device comprises a semiconductor chip 2 which has a main surface 2b, a plurality of pads 2a arranged on the main surface 2b, rearrangement wires 2e which are formed on the main surface 2b and change the arrangement of respective pads 2a, and a protective film 2g and an insulating film which are formed on the main surface 2b. The semiconductor device also includes a plurality of soldered bumps 3 which are connected to the rearrangement wires 2e, respectively, and formed to be different in arrangement from the pads 2a. A bevel cut surface 2m which is continuous diagonally with the main surface 2b is formed on the periphery of the main surface 2b to prevent the chipping of the semiconductor chip 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
