| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate in which the electrode of a chip can be wired easily and stably on the substrate and which is thin with high reliability, and to provide a method of manufacturing the same and an electronic apparatus using the circuit substrate. SOLUTION: The method of manufacturing the circuit substrate includes a step of disposing the chip 12 in a through hole 11A provided in the aperture substrate 11 corresponding to the height of the chip 12, and a step of forming a wiring pattern 13 on the aperture substrate 11 and wiring the wiring pattern 13 to the electrode 12A on the chip 12. Further, a support material 14 is attached to the aperture substrate 11. COPYRIGHT: (C)2005,JPO&NCIPI |
