| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination for an anti-magnetic wave shield which secures the flatness of a base material and is highly reliable. SOLUTION: The lamination for the anti-magnetic wave shield is formed by laminating a transparent base material with a conductive metal foil via an adhesive layer. The adhesive layer contains fine air bubbles (having a diameter of 10μm or more to 100μm or less) at a distribution density of 3 bubbles/cm<SP>2</SP>or less, and, preferably, contains a radiation curing resin. COPYRIGHT: (C)2005,JPO&NCIPI
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