| 摘要 |
A device to cool an integrated circuit element, the device having a printed circuit board with a through hole smaller than the integrated circuit element; a cooling pad attached to a first element surface of the integrated circuit element, and positioned inside the through hole; and a heat transfer portion connected with a heat absorption body and making contact with the cooling pad, to transfer heat to the heat absorption body, so that the integrated circuit element is cooled by transferring the heat generated in the integrated circuit element, which is mounted on a first surface of the printed circuit board, to the heat absorption body, which is disposed facing a second surface of the printed circuit board opposite the first surface.
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