发明名称 Method of forming patterns
摘要 In forming a mask pattern on a circuit board, a mask pattern of N-layer structure is formed in a region where the mechanical strength of the circuit board needs to be increased. N photosensitive layers are first stacked on a substrate so that they becomes lower in sensitivity from the first photosensitive layer toward the N<SUP>th </SUP>photosensitive layer. In the first photosensitive layer (bottom layer), a first pattern is formed and has the same shape as a predetermined pattern to be formed on the circuit board. In the K<SUP>th </SUP>photosensitive layer (N>=K>=2), a K<SUP>th </SUP>pattern is formed so that the K<SUP>th </SUP>pattern is smaller than a (K-1)<SUP>st </SUP>pattern formed in the (K-1)<SUP>st </SUP>photosensitive layer and arranged inside the (K-1)<SUP>st </SUP>pattern.
申请公布号 US2005153567(A1) 申请公布日期 2005.07.14
申请号 US20050033970 申请日期 2005.01.13
申请人 FUJI PHOTO FILM CO., LTD. 发明人 SASAKI YOSHIHARU
分类号 G03F7/26;G03F7/095;H01L21/302;H05K3/00;H05K3/06;(IPC1-7):H01L21/302 主分类号 G03F7/26
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