发明名称 |
Method of forming patterns |
摘要 |
In forming a mask pattern on a circuit board, a mask pattern of N-layer structure is formed in a region where the mechanical strength of the circuit board needs to be increased. N photosensitive layers are first stacked on a substrate so that they becomes lower in sensitivity from the first photosensitive layer toward the N<SUP>th </SUP>photosensitive layer. In the first photosensitive layer (bottom layer), a first pattern is formed and has the same shape as a predetermined pattern to be formed on the circuit board. In the K<SUP>th </SUP>photosensitive layer (N>=K>=2), a K<SUP>th </SUP>pattern is formed so that the K<SUP>th </SUP>pattern is smaller than a (K-1)<SUP>st </SUP>pattern formed in the (K-1)<SUP>st </SUP>photosensitive layer and arranged inside the (K-1)<SUP>st </SUP>pattern.
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申请公布号 |
US2005153567(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
US20050033970 |
申请日期 |
2005.01.13 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
SASAKI YOSHIHARU |
分类号 |
G03F7/26;G03F7/095;H01L21/302;H05K3/00;H05K3/06;(IPC1-7):H01L21/302 |
主分类号 |
G03F7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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