发明名称 POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD
摘要 A polishing pad which ensures that a work can be easily removed from the polishing pad surface after polishing, the amount of a polishing liquid used for polishing can be reduced, and the production cost of the polishing pad can be lowered. A first polishing pad ( 1 ) for polishing a work is provided with a plurality of slots ( 11 ) piercing the first polishing pad ( 1 ) in a sa direction, the length in the longitudinal direction of the slots ( 11 ) being preferably not less than 20 mm, the pitch in the width direction of the slots ( 11 ) being preferably less than 100 mm, and small holes (not shown) may be provided in addition to the slots ( 11 ).
申请公布号 US2005153633(A1) 申请公布日期 2005.07.14
申请号 US20050503413 申请日期 2005.03.07
申请人 SHIBUKI SHUNICHI 发明人 SHIBUKI SHUNICHI
分类号 B24B37/00;B24B37/04;B24B37/20;B24B37/26;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B37/00
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