| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for optical semiconductor element housing wherein junction breakdown by thermal stress or a mechanical shock from the outside can be prevented effectively and airtight reliability is high, and to provide an optical semiconductor device. <P>SOLUTION: A tabular lid 3 is formed by inserting a window member 3b of translucency in an opening of a metal frame 3a. In the metal frame 3a, a longitudinal section profile of the inner peripheral surface 4 of the opening is made a curved surface which is protruded to the center side of the opening. The window member 3b is composed of glass wherein a softening point exceeds 300°C, a coefficient of thermal expansion is smaller than that of the metal frame 3a, and a difference of coefficients of thermal expansion with the metal frame 3a at 20-300°C is 0-1.0×10<SP>-6</SP>/°C, and directly joined to the opening. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
