| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable flame retardant composition for a resist having both flame retardancy and flexibility, suitable for use as a cover lay for FPC, a solder resist, etc., and excellent in solder heat resistance, moisture resistance and high temperature reliability. <P>SOLUTION: The curable flame retardant composition for a resist contains a (co)polymer of a bromine compound shown by formula (1) and/or formula (2) and a curable resin material for a resist. There are provided a heat cured object of the resist composition, an ink containing the resist composition and a colorant, a method for curing the resist composition, an insulating protective coating and an interlayer insulating film comprising the resist composition, and a printed wiring board with the film. In the formulae, R represents H or methyl; and X<SP>1</SP>-X<SP>10</SP>each independently represents H or Br with the proviso that at least two of X<SP>1</SP>-X<SP>5</SP>and at least two of X<SP>6</SP>-X<SP>10</SP>are Br. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
