| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology which can enhance the mounting reliability of a semiconductor device, and a technology which can miniaturize the semiconductor device. <P>SOLUTION: The lead of the semiconductor device has a first face located between the main face of a resin sealing body and a rear face on a reverse side to the main face; a second face which is located on the reverse side to the first face, and is exposed from the rear face of the rear sealing body; a first front end face located on a semiconductor chip side; a second front end face which is located on the reverse side to the first front end face, and is exposed from the side face of the rear sealing body, and a recess which is depressed on the first face side from the second face and is contiguous to the second front end face. The second face and the inner wall face of the recess are coated with a plating layer with a higher solder wettability than the second front end face of the lead. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
