| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state imaging apparatus which can mount a solid-state imaging element in the curving state with good handling property without breakdown during the handling thereof and can enhance the manufacturing yield thereof. SOLUTION: In the manufacturing process of a solid-state imaging apparatus, a protection tape 6 is adhered to the upper surface of a silicon substrate 1 where the solid-state imaging element 2 is formed on the surface layer, and the silicon substrate 1 is then processed for reducing the thickness. Next, the silicon substrate 1 which is reduced in the thickness is allocated on the surface of a base 4 for curving which is coated with a bonding agent 3. Moreover, pressure is applied to the upper surface of the protection tape 6 to expand downward the silicon substrate 1. Consequently, the silicon substrate 1 and the solid-state imaging element 2 are curved to the predetermined shapes. Under this state, the bonding agent 3 is hardened and the silicon substrate 1 or the solid-state imaging element 2 are fixed on the base 4 for curving under the curved state. Thereafter, a solid-state imaging element chip can be obtained through the dicing process. COPYRIGHT: (C)2005,JPO&NCIPI
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