发明名称 SURFACE TREATMENT METAL POWDER, CONDUCTIVE PASTE USING SAME, AND PRINTED WIRING BOARD AND CHIP COMPONENTS OBTAINED BY USING CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide metal powder with which conductive paste doing without a viscosity adjustment as far as possible can be obtained and the conductive paste. SOLUTION: A surface treatment layer that surface treatment metal powder is equipped with on the powder surface is formed of an organic compound having both an acid radical and a base. The organic compound having the both acid radical and base has an acid number within the range of 10(KOHmg/g) to 110(KOHmg/g), and an amine value within the range of 15(KOHmg/g) to 150(KOHmg/g). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005190907(A) 申请公布日期 2005.07.14
申请号 JP20030433054 申请日期 2003.12.26
申请人 MITSUI MINING & SMELTING CO LTD 发明人 SAKAGAMI TAKAHIKO;YOSHIMARU KATSUHIKO
分类号 C09C1/62;B22F1/02;C09C3/10;H01B1/22;H01B5/00;H05K3/12;(IPC1-7):H01B5/00 主分类号 C09C1/62
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