发明名称 |
SURFACE TREATMENT METAL POWDER, CONDUCTIVE PASTE USING SAME, AND PRINTED WIRING BOARD AND CHIP COMPONENTS OBTAINED BY USING CONDUCTIVE PASTE |
摘要 |
PROBLEM TO BE SOLVED: To provide metal powder with which conductive paste doing without a viscosity adjustment as far as possible can be obtained and the conductive paste. SOLUTION: A surface treatment layer that surface treatment metal powder is equipped with on the powder surface is formed of an organic compound having both an acid radical and a base. The organic compound having the both acid radical and base has an acid number within the range of 10(KOHmg/g) to 110(KOHmg/g), and an amine value within the range of 15(KOHmg/g) to 150(KOHmg/g). COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005190907(A) |
申请公布日期 |
2005.07.14 |
申请号 |
JP20030433054 |
申请日期 |
2003.12.26 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
SAKAGAMI TAKAHIKO;YOSHIMARU KATSUHIKO |
分类号 |
C09C1/62;B22F1/02;C09C3/10;H01B1/22;H01B5/00;H05K3/12;(IPC1-7):H01B5/00 |
主分类号 |
C09C1/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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