发明名称 |
TEMPERATURE REGULATING METHOD FOR SUBSTRATE TREATING SYSTEM AND SUBSTRATE TREATING SYSTEM |
摘要 |
<p>A substrate treating system comprising a plurality of CVD treating devices (15a-15c) and one refrigerating machine (101). A supply path (102) for supplying refrigerant from the refrigerating machine to respective CVD treating devices, and a feedback path (103) for feeding back refrigerant to the refrigerating machine from respective treating devices are provided. Therefore, refrigerant is dividedly supplied to respective treating devices from the refrigerating machine. Respective treating devices are respectively provided with circulating paths (104a-104c) passing through rod stages (33) as the objects of temperature regulation, with respective circulating paths connected to the supply path and the feedback path. Refrigerant is allowed to circulate through circulating paths to constantly regulate the temperature of the rod stages. Upon a rise in temperature at a rod stage, low-temperature refrigerant is supplied into a circulating path from the supply path to cool it.</p> |
申请公布号 |
WO2005064659(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
WO2004JP19406 |
申请日期 |
2004.12.24 |
申请人 |
TOKYO ELECTRON LIMITED;NOZAWA, TOSHIHISA;KOTANI, KOJI |
发明人 |
NOZAWA, TOSHIHISA;KOTANI, KOJI |
分类号 |
F25D17/02;C23C16/46;F25D9/00;F25D13/00;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205 |
主分类号 |
F25D17/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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