| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic wiring board capable of simply and precisely forming semiconductor components and a wiring structure to be incorporated even if the semiconductor components to be packaged are miniaturized or highly integrated and the wiring structure to be incorporated becomes complicated and fine. <P>SOLUTION: A conductor accommodation recess for accommodating a laminar conductor element 30 for forming a wiring section is formed on at least one main surface side of a unit plate made of a close-grained ceramic material, and the conductor accommodation recess is filled with a metal material for forming the laminar conductor element 30, thus manufacturing a unit plate filled with metal. The unit plate 55 filled with metal is laminated in the plate thickness direction for bonding, thus forming a ceramic dielectric layer 50 by the unit plate, and obtaining a laminate 2M in which a metal conductive layer is formed by the laminar conductor element 30. Then, before and after bonding, conductor patterns 514, 517 for composing a circuit element, such as a thin-film capacitor, are retrofitted for film-formation on the main surface of at least one of the unit plates. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
