| 摘要 |
PROBLEM TO BE SOLVED: To form sound copper wiring free of voids by securely applying plating on the whole region in the surface of a substrate even if sheet resistance at the time of forming an initial plating film is high. SOLUTION: Regarding the device, an anode 48 arranged at the position located in a plating tank holding a plating liquid and arranged at the position facing a substrate W is composed of a plurality of planar divided anodes 48a, 48b and 48c concentrically divided so as to be connected with plating power sources 51a, 51b and 51c, individually, and the distance between each divided anode 40a, 48b and 48c and the substrate W is made individually changeable. COPYRIGHT: (C)2005,JPO&NCIPI
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