METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and semiconductor device manufacturing equipment that can easily suppress burrs generated during dicing of a semiconductor wafer low to prevent resulting electric defects. SOLUTION: When semiconductor devices are manufactured by dividing the semiconductor wafer having a metal pattern 4 formed on the surface of a scribe line region 3 into individual semiconductor chips, a process of pressing a cutting rotary blade 6 is performed against the scribe line region 3 to cut the semiconductor wafer 1 along the thickness, and a process of pressing a burr pressing blade 8 is performed against cutting lines 7 of the semiconductor wafer 1 cut with the cutting rotary blade 6 to press burrs generated from the metal pattern 4 low. COPYRIGHT: (C)2005,JPO&NCIPI