| 摘要 |
PROBLEM TO BE SOLVED: To provide the packaging structure of an electronic part which can improve reliability of soldering by preventing certainly the disposing deviation of the electronic part from occurring at the soldering time, and which can radiate the heat generated from the electronic part efficiently. SOLUTION: The packaging structure of the electronic part includes large and small lands 11 and 12 formed on a substrate 10, and a plurality of through holes 13 formed at the periphery of a large-sized land 11 in such a manner that the electronic part 20 is soldered to the lands 11, 12 through the solder. The large-sized land 11 is divided and formed by an insulating film 14, and a plurality of through holes 15 are formed at the part of the insulating film 14 obtained by dividing the large sized land 11. COPYRIGHT: (C)2005,JPO&NCIPI
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