| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing film, exhibiting superior performance for follow up of the protruding/recessed shape on the surface, flexibility, strength, and thermal resistance, without containing an adhesive, and to provide a cutting method of a semiconductor wafer which uses the dicing film. SOLUTION: The dicing film is composed of an elastomer composition containing at least one kind of polymer, selected from among a hydrogen additive of diene-based block polymer and a polar group denatured olefin based polymer. Hydrogen additive of conjugated diene block polymer or hydrogen additive of a block polymer, composed of conjugated diene and aromatic vinyl compound, is preferably employed as the hydrogen additive of diene-based block polymer. COPYRIGHT: (C)2005,JPO&NCIPI |
