| 摘要 |
PROBLEM TO BE SOLVED: To perform releasing treating of a surface protective tape in a single wafer without using a special purpose device by utilizing an existing wafer mount processing unit effectively. SOLUTION: The processing apparatus 1 for mounting the wafer includes a control means for performing dicing tape laminating treating to a mounting frame, wafer attaching treating of adhering and holding a semiconductor wafer adhered with the surface protective tape on the dicing tape of the mounting frame, and surface protective tape releasing treating of releasing the surface protective tape from the semiconductor wafer held by the mounting frame in a predetermined sequence. A wafer supplying and recovering device for supplying and conveying the semiconductor wafers each adhered with the surface protective tape one by one is coupled to the processing apparatus 1, the wafer supplying and recovering device is controlled to be operated by communicating information with the main controller of the wafer mounting processing apparatus, and the surface protective tape of the supplied semiconductor wafer is processed to be released by a surface protective tape releasing mechanism in the wafer mounting processing apparatus 1. COPYRIGHT: (C)2005,JPO&NCIPI |
