| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which a crack develops in a junction interface section, the corrosion of a conductor layer due to a contact with the outside air is prevented and malfunctions when the board is operated can be avoided, and to provide a manufacturing method for the wiring board. SOLUTION: The wiring board 8 has an insulating board, having at least an insulator layer 1 composed of ceramics and the conductor layer 3, having approximately the same thickness as the insulator layer 1. The wiring board 8 is constituted so that a surface boundary on the surface side of the wiring board 8, at a boundary between the insulator layer 1 of the insulating board formed on the outermost layer of the wiring board 8 and the conductor layer 3 is coated with a coating resin layer 7 containing a resin. COPYRIGHT: (C)2005,JPO&NCIPI |
