| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that pores are not sufficiently filled with a plating film, which occurs even in electrolytic copper plating with the use of an anode of an insoluble metal. SOLUTION: A metallic-film-formed plate 111 is a resin substrate having a copper foil formed thereon, and is immersed in a plating liquid stored in a controlling tank 102. The metallic-film-formed plate 111 is, for instance, fixed on a holder 112 and is immersed in the plating liquid, and the holder 112 is held, for instance, by a holder-fixing part 113 which is fixed on an upper periphery of the controlling tank 102. The copper foil of the metallic-film-formed plate 111 is in an electrically floating state in the plating liquid. COPYRIGHT: (C)2005,JPO&NCIPI
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