发明名称 |
METHOD AND STRUCTURE FOR INTEGRATING THERMISTOR |
摘要 |
A structure and method are provided for forming a thermistor. Isolation structures are formed in a substrate including at least an upper layer of a single crystal semiconductor. A layer of salicide precursor is deposited over the isolation region and the upper layer. The salicide precursor is then reacted with the upper layer to form a salicide self-aligned to the upper layer. Finally, the unreacted portions of the salicide precursor are then removed while preserving a portion of the salicide precursor over the isolation region as a body of the thermistor. An alternative integrated circuit thermistor is formed from a region of thermistor material in an embossed region of an interlevel dielectric (ILD).
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申请公布号 |
US2005151213(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
US20040707746 |
申请日期 |
2004.01.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CASEY JON A.;FERRANTE WILLIAM J.;KIEWRA EDWARD W.;RADENS CARL J.;TONTI WILLIAM R. |
分类号 |
H01L21/28;G01K7/22;H01C7/00;H01L21/3205;H01L21/762;H01L21/768;H01L21/822;H01L23/52;H01L27/04;(IPC1-7):H01L21/00;H01L27/14;H01L29/82;H01L31/058 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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