| 发明名称 |
Cooling devices and methods of using them |
| 摘要 |
A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
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| 申请公布号 |
US2005151554(A1) |
申请公布日期 |
2005.07.14 |
| 申请号 |
US20040892303 |
申请日期 |
2004.07.15 |
| 申请人 |
COOKSON ELECTRONICS, INC. |
发明人 |
RAE ALAN;SINGH BAWA;VARNELL WILLIAM D.;GULINO ANGELO J.;HOLTZER MITCH;ABYS JOE;LEWIS BRIAN |
| 分类号 |
G01R31/02;H01L21/60;H01L23/36;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/02 |
| 代理机构 |
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