POLYIMIDE FILM

摘要

[PROBLEMS] To provide a polyimide film suitable for use as a base material film of electronic components that excels in thermal stability, rigidity and high-frequency characteristics and also excels in heat distortion stability such that failure due to curling would not occur even when various functiona l layers are superimposed thereon while heating. [MEANS FOR SOLVING PROBLEMS] A polyimide film wherein the in-plane orientation coefficient of the film, measured by X-ray diffractometry, is in the range of 0.79 to 0.89, the difference between the degree of surface in-plane orientation with respect t o one major surface of the film and the degree of surface in-plane orientation with respect to the other major surface of the film being 2 or less, and wherein the degree of curling of the film is 5% or less, is obtained by imidizing a polyimide precursor film of specified imidization ratio.