| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent bubbles from being generated in a resin in a packaging part, as much as possible, in a semiconductor device of a resin molding type, having a reference terminal and heat sinks connected electrically/thermally to the main surfaces of the front and rear surfaces of a semiconductor chip, made of a vertical-type power element, etc. <P>SOLUTION: The semiconductor device S1 is provided with the semiconductor chips 10, 11, the lower side heatsink 20 connected to the main rear surface side of the semiconductor chips 10, 11, and the upper-side heatsink 30 connected to the main front surface side of the semiconductor chips 10, 11, in such a manner that the substantially the entirety of the device is molded with a resin 80 molded by a mold. A hole 81 is provided as a resin flow disturbing part for disturbing the flow of the resin, at the molding of the resin 80, is provided in a thick part disposed at the periphery of the packaging part 90 of the resin 80. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
