| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition capable of polishing a quickly polishing target material even if grain diameter of alumina is small, and reducing surface defect of the polishing target material after being polished. <P>SOLUTION: The polishing composition contains alumina, colloidal silica, citric acid, organic acid other than citric acid, oxidizing agent, and water, and is used in an application for polishing a substrate for a magnetic disk for example. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
