| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that does not increase costs greatly as compared with a resin-sealing method, does not generate any problems in reliability, such as the connection failure of a bump electrode, and the cracks/separation, or the like of a sealing resin, and does not decrease the space around the semiconductor package in which the packaging positions of a semiconductor chip differ on both the surfaces of a wiring board; and to provide a method for manufacturing the semiconductor package. SOLUTION: In the semiconductor package 8 for packaging the semiconductor chips 3a, 3b on both the surfaces of the wiring board 2, regions that oppose while sandwiching the bump electrode 4 of the second semiconductor chip 3b packaged at least on the second surface and the wiring board 2 in the outer periphery of the first semiconductor chip 3a packaged on the first surface of the wiring board 2 are essentially covered to the height of the first semiconductor chip by a resin sheet 1, and the rear surface of the first semiconductor chip is exposed. COPYRIGHT: (C)2005,JPO&NCIPI
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