| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck which can increase the plasma resistance and abrasion resistance without jump up of a held substrate, caused by residual charge and can quickly and uniformly control the in-plane temperature of the front face of the held substrate to a specified temperature or a specified temperature distribution. SOLUTION: An electrostatic chuck 16, which holds a wafer W by using electrostatic force, has multiple protrusions 16C that make contact with the wafer W. The protrusions 16C are made of a ceramic dielectric 16A, which includes alumina crystal grains having an average grain diameter of 1 to 2μm, and comprise faces to make contact with the wafer W, which are formed so as to have a surface roughness of Ra 0.2 to 0.3μm that depends on the grain diameter. COPYRIGHT: (C)2005,JPO&NCIPI |
