| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer end face polishing device, easily shaping the end face of a wafer even if the end face is shaped unsymmetrical and simplifying the configuration of the device. SOLUTION: This wafer end face polishing device 10 includes: a wafer rotating mechanism 3 supporting a wafer 12 formed substantially disc-like and rotating the wafer around the axis; and a tape transfer mechanism 18 for transferring a polishing tape 16 guided by a pair of rollers 501, 502 provided in positions for clamping the rotating surface of the wafer supported by the wafer rotating mechanism 14 in the direction of crossing the rotating surface of the wafer, wherein the polishing tape is brought into sliding contact with the end face of the rotating wafer to polish the end face of the wafer. The paired rollers 501, 502 are respectively moved in the direction of coming close to and separating from the waver end face 23 independently. COPYRIGHT: (C)2005,JPO&NCIPI |
