| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and an electric apparatus capable of inhibiting defective electric conduction and capable of shortening a production time, and to provide manufacturing methods for the wiring board and the electric apparatus. SOLUTION: The wiring board has insulating layers 9 each containing at least a resin, a wiring conductor layer 15 formed on the surface of the insulating layer 9, and via conductor layers 13 penetrated to the insulating layers 9 and connecting the wiring conductor layer 15 separated from the insulating layers 9. The wiring conductor layer 15 is constituted by successively forming an evaporation metallic layer 15a and an electrolytic plating layer 15b on the main surface of the insulating layer 9. The via conductor layers 13 are constituted by successively forming the evaporation metallic layer 13a, an electroless copper plating layer 13b, and the electrolytic plating layer 13c in through-holes 11 formed to the insulating layers 9. COPYRIGHT: (C)2005,JPO&NCIPI |
