WAX FOR TEMPORARILY BONDING MATERIAL TO BE ETCHED

摘要

A wax for temporarily bonding a material to be etched is characterized by having a viscosity at 80˚C of not less than 1.7 Pa.s, a viscosity at 100˚C of not more than 0.50 Pa.s, and a softening point of not less than 57˚C. This wax contains, in mass%, 40-50% of a rosin, 20-30% of an acid-modified rosin and 20-30% of a higher fatty acid. The wax is suitably used for temporarily bonding a semiconductor wafer to be etched to a supporting substrate.