| 摘要 |
PROBLEM TO BE SOLVED: To see to it that every wafer is developed in an optimum time length. SOLUTION: In this wafer development method, a developer is supplied to the surface of a resist film formed on a wafer, and during the development of the resist film, the line width of a pattern on the resist film is measured. Line width measurement is repeatedly performed during the development process. Upon the detection of a predetermined line width in line width measurement, development is halted. In this way, the pattern of a desired line width is formed for each wafer, and each wafer is developed in an optimum time length. COPYRIGHT: (C)2005,JPO&NCIPI |
