发明名称 ELECTROMOLDING SUBSTRATE, MANUFACTURING METHOD THEREFOR AND METHOD FOR MANUFACTURING PLATED LAYER
摘要 PROBLEM TO BE SOLVED: To provide an electromolding substrate, particularly which can be repeatedly used more times for molding a plated layer than ever, and can finely form the plated layer into a predetermined shape at a satisfactory yield; a manufacturing method therefor; and a method for manufacturing the plated layer. SOLUTION: The electromolding substrate 1 has a patterned part 3 with a recess shape, which has the same shape as the plated layer, formed on the surface 1a. The patterned part 3 has a separating film 4 made of ZnO or the like provided on the side wall face 3a and the bottom face 3b. The plated layer which has been electromolded in the patterned part 3 can be easily peeled off from the separating film 4, whereas the separating film 4 is left in the patterned part 3 of the electromolding substrate 1, just as it has been, so that the electromolding substrate 1 can be repeatedly used in the state of having the separating film 4 thereon every time after having formed the plated layer, and accordingly, a productivity for the plated layer can be improved. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005187921(A) 申请公布日期 2005.07.14
申请号 JP20030433742 申请日期 2003.12.26
申请人 ALPS ELECTRIC CO LTD 发明人 NAGANO SHINICHI
分类号 G01R1/073;C23C18/18;C23F4/00;C25D1/20;H01R13/24;H01R43/16;(IPC1-7):C25D1/20 主分类号 G01R1/073
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