HARD THICK FILM, AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve problems that the internal stress is high in a thick film of≥10μm in thickness, a hard film is easily peeled from a substrate, and cathodes for both a single metal and a multicomponent metal are required and productivity is decreased if using a stress-relieving layer of single metal in a case of a multi-metal nitride by the ion-plating. SOLUTION: The internal stress is reduced to suppress peeling by depositing a hard thick film coating having a structure that a stress-relieving layer based on a non-columnar crystalline compound metal nitride layer deposited at the low bias voltage is inserted by a predetermined thickness at a predetermined interval in a columnar crystalline multi-metal nitride coating deposited at the high bias voltage. The hard film coating is deposited by repeating a step A of depositing a columnar crystalline multi-metal nitride layer for a predetermined time and a step B of depositing a non-columnar crystalline multi-metal nitride layer for a predetermined time. COPYRIGHT: (C)2005,JPO&NCIPI