发明名称 MOLTEN SOLDER BATH, ITS MANUFACTURING METHOD, FLOW SOLDERING METHOD, AND MANUFACTURING METHOD OF ELECTRIC AND ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To provide a molten solder bath capable of preventing erosion even if lead-free solder is used, to provide the manufacturing method of the bath and the flow soldering method, and also to provide the manufacturing method of electric and electronic components using this molten solder bath. SOLUTION: The molten solder bath uses austenitic stainless steel with a martensitic phase of≤3 vol.% for the composition of the bath to store molten solder. Also, the molten solder bath uses annealing and warm working at the time of manufacturing or maintenance, for the purpose of reducing its martensitic phase to≤3 vol.%. As a result, the erosion resistance of the stainless steel is improved relative to lead solder and lead-free solder, enabling the life of the solder bath to be extended. The use of this molten solder bath facilitates maintenance control of the solder bath, thereby it is possible to provide the flow soldering method and the manufacturing method of electric and electronic components with superior productivity. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005186149(A) 申请公布日期 2005.07.14
申请号 JP20030433748 申请日期 2003.12.26
申请人 OSAKA INDUSTRIAL PROMOTION ORGANIZATION 发明人 TAKEMOTO TADASHI
分类号 B23K3/06;B23K1/008;B23K1/08;B23K35/26;C22C13/00;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K3/06
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