| 摘要 |
PROBLEM TO BE SOLVED: To reduce the space shared by a semiconductor manufacturing apparatus. SOLUTION: First and second drawout rails R<SB>1</SB>, R<SB>2</SB>are fitted in nesting to an inner side face of both side walls 2a of a carrier table 2 with a wafer carrier C mounted thereon in a device body 1 of a load port device A, a wafer table 6 is fitted to the second drawout rail R<SB>2</SB>being the inner rail via a base plate 14 to configure an unload device U when sampling inspection is applied to a wafer W, the wafer W extracted from a wafer process apparatus B is placed on a wafer mount 9 of the wafer table 6, the base plate 14 is extracted, and the wafer table 6 is placed at a wafer extract position P<SB>2</SB>to extract the wafer. COPYRIGHT: (C)2005,JPO&NCIPI
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