| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with a capacitor element in which a connection pad and a semiconductor element can be connected well through a solder bump. SOLUTION: Solder bumps 6 are welded to first connection pads 2a, 2b and 2c of an insulating substrate 1 having an upper surface provided with the first connection pads 2a, 2b and 2c being connected electrically with a semiconductor element, and a lower surface provided with second connection pads 3a, 3b and 3c being connected electrically with an external electric circuit board and third connection pads 5a and 5b being connected electrically with a capacitor element. A capacitor element 8 is connected with the third connection pads 5a and 5b through solder 9 having a melting point higher than that of the solder bump 6, and a solder layer 7 having a melting point lower than that of the solder 9 is welded to the second connection pads 3a, 3b and 3c. COPYRIGHT: (C)2005,JPO&NCIPI
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