| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that has the mounting area reduced by improving a structure of arranging electrode wires. <P>SOLUTION: A positive conductor substrate 10, a negative conductor substrate 12, and an output conductor substrate 14 are provided on an insulated substrate 34. A positive bus bar 16 and a negative one 18 are connected to the positive conductor substrate 10 and the negative conductor substrate 12, and are arranged in an erect condition, in substantially the normal line direction of each corresponding conductor substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
