| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligning mechanism which executes a positioning in a rotating direction of a wafer without applying damage to the wafer, and also to provide a wafer conveying hand finishing the positioning in the rotating direction while conveying. SOLUTION: After a wafer W is caught by a wafer conveying hand 10 in such a way of swirling flow generated by an air discharged from an air discharge opening 12, the movement of the wafer W in the planar direction of the wafer W is regulated by transferring a slider 13 in the guiding direction of an arrow a1. At that moment, from a rotating rotor 14 to the wafer W, only a slight thrusting force is required to rotate the wafer W. COPYRIGHT: (C)2005,JPO&NCIPI |
