发明名称 PACKAGE FOR PRESSURE SENSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a package for pressure sensing device which is small in size and sensitive and capable of exactly detecting external pressure. SOLUTION: The device comprises an insulation base 1 having a loading part 1a of a semiconductor element 3 on one main surface, a plurality of wiring conductors 5 connected by individual electrodes of a semiconductor elements 3, a first and a second insulation plates 2, 2' contacted to the insulation base 1 in flexible state so as to form a first and a second closed spaces between the other main surface of the insulation base 1 and the plates, a first and a second electrodes 7, 7' for forming capacitance which are put on the other main surface of the insulation base 1 in the first and the second closed spaces and electrically connected to the wiring conductors 5, and a third and a fourth electrodes 9, 9' for forming capacitance which are put on the inner main surface of the first and the second insulation plates 2, 2' so as to face the first and the second electrodes 7, 7' and electrically connected to the wiring conductors 5. The first insulation plate 2 and the second insulation plate 2' have different area of region exposed to each inner main surface. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005188989(A) 申请公布日期 2005.07.14
申请号 JP20030427993 申请日期 2003.12.24
申请人 KYOCERA CORP 发明人 KINOMURA KOJI;MORIYAMA YOSUKE
分类号 G01L19/14;G01L9/12;(IPC1-7):G01L19/14 主分类号 G01L19/14
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