DECONTAMINATION OF SUPERCRITICAL WAFER PROCESSING EQUIPMENT

摘要

A method is disclosed for decontaminating a supercritical processing apparatus and/or wafers after a wafer (213) cleaning step. In accordance the embodiments of the invention, a supercritical cleaning step (501) utilizes a surfactant to clean a wafer (213) and uses a supercritical rinse solution in a post-cleaning step (505) to decontaminate the supercritical processing apparatus, the wafer or both from processing residues. In accordance with further embodiments of the invention, supercritical rinse solutions are used to cure processing surfaces of the supercritical processing apparatus after the supercritical processing apparatus is serviced or when replacement parts are installed.